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Thailand's consumer confidence index rose to 56.9 in November, boosted by stimulus measures, and Thailand's consumer confidence index rose from 56.0 to 56.9 in November.Iflytek and other robot technology companies have a registered capital of 30 million yuan. According to Tianyancha App, Anhui Lingdong General Robot Technology Co., Ltd. was recently established with Hu Guoping as the legal representative and a registered capital of 30 million yuan. Its business scope includes industrial robot manufacturing, industrial robot sales, intelligent robot research and development, electrical equipment sales, computer software and hardware and auxiliary equipment retail, information system integration services, intelligent robot sales, mechanical equipment leasing, etc. According to shareholder information, the company is jointly held by Anhui Xunfei Yunchuang Technology Co., Ltd., a subsidiary of Iflytek (002230), Anhui Yanzhi Technology Co., Ltd. and Anhui Lingji Wanwu Technology Partnership (Limited Partnership).Shanghai Nickel's main contract has expanded, and now it has risen by more than 3% to 129,170 yuan/ton.

Prime Minister of Thailand: It is estimated that the GDP growth rate will exceed 3% in the fourth quarter.Prime Minister of Thailand: The third phase of relief funds will be distributed next year.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)

The Thai government plans to launch digital wallet distribution in 2025.Korean Air passed the US antitrust review, clearing the way for completing the Asiana Airlines transaction.Goldman Sachs: The Bank of Japan has not reached the level where it can judge that it has enough confidence in the future. In this case, it is expected that the Bank of Japan will keep its policy interest rate unchanged at 0.25% at its meeting in December.